5.2. PackagesΒΆ
The package library lists all the Power switches: discretes & modules casing/packages.
Each package entry contains the package dimensions, mass and isolation voltage.
These quantities are used in different ways in a design evaluation.
- Dimensions (x, y ,z)
are the external dimensions of the package. The package is assumed to be rectangular block shaped. The package volume is considered in the macrocell volume after an evaluation.
- Package area (x * y)
is used to check if the total package area of the module is smaller than the cooling system surface. In the case of auto-design, the package area is used to design the cooling system dimensions. For example, a fin heatsink baseplate area needs to be larger than the package area of all the modules used.
- Thermal dissipation area (\(S_{Dissipation}\))
is always lower than the package area. It is used to estimate the contact area between the package and the cooling system. If a thermal interface is used, the thermal resistance of this thermal interface is calculated based on this thermal dissipation area.
\[R_{th(c-s)} = S_{Dissipation} \cdot R_{th Interface}\]where \(R_{th Interface} [K.m^2/W]\) is the thermal interface per surface unit
- Isolation voltage
If the value is above 0, the package is considered isolated. If the package is NOT isolated, an insulating thermal interface must be used.
